Die Deprocessing

Die delayering or deprocessing is that the

semiconductor failure analysis technique of denudation off the higher

layers of the die to show a defect web site that's buried beneath these

layers. Die delayering is sometimes done as a sequence of steps,

removing a layer or 2 at a time. Since every layer is with chemicals and

physically completely different from the others, the delayering steps are

completely different from one another further.

Descum 

 Photoresist residue sometimes remains after development, processing, and resist strip. Plasma treatment provides uniform removal of small quantities of resist over the entire surface of the wafer prior to further post processing.

Examples of other process application

l SEM/TEM sample cleaning for hydrocarbon contamination removal

Surface treat before biomedical coating and improve hydrophilicity of medical implants

Optics, glass and substrate cleaning before epoxy bonding

Photoresist ashing, descum and silicon wafer cleaning

PDMS, microfluidics, glass slides and lab-on-a-chip

Improve bonding for metal to metal or composite

Improve bonding for plastic, polymer and composite materials

Medical device activation, sterilization and improve coating adhesion

Cleaning before wire bonding, die attach, flip chip bonding process.